MINAPAD Forum 2018

Le sixième forum MiNaPAD (Micro/Nano-Electronics Packaging and Assembly, Design and Manufacturing) aura lieu les 16 et 17 mai 2018 au World Trade Center. 

Les thèmes abordés seront les suivants  :

• Advanced Packaging : 2.5D/3D Packaging, TSV, WLP, FOWLP, Embedded IC Packages, Substrates
• CAD and tools for I/O placement for advanced packaging, DfR, opto & RF packages design, thermal & mechanical modeling & simulation
• Digital deep submicron technologies for scaling nodes, MEMS, sensors & actuators, RF miniaturization, smart system packaging & heterogeneous integration
• Innovative packaging for engineering and growing applications
• Materials (adhesives, underfills, molding, dielectrics,…)
• Emerging technologies and novel approaches: microfluidics, carbon nano tubes
• Assembly manufacturing (BGA, CSP, QFN, SiP, cleaning, coating,…)
• Reliability, Wear out, test and characterization, electromigration, thermal management
• Advanced interconnections: FlipChip, WLP metallurgies, bumping techniques, nontraditional interconnections, optical connections